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Molex introduces MX60 series of contactless connectivity solutions to ease device pairing, streamline design engineering and boost product reliability

Molex, a global electronics leader and connectivity innovator, has diversified its robust product portfolio with the introduction of the MX60 series of contactless connectivity solutions

Molex, a global electronics leader and connectivity innovator, has diversified its robust product portfolio with the introduction of the MX60 series of contactless connectivity solutions. These low-power, high-speed, solid-state devices feature miniaturized mmWave RF transceivers and built-in antennas in one complete package for faster, simpler, device-to-device communications without the use of physical cables or connectors. As a result, MX60 solutions offer greater product design freedom, seamless device pairing and increased communications reliability for video displays, sleek and light consumer electronics, industrial robotics and devices operating in harsh environments.

“The distinct product design and development advantages enabled by our MX60 contactless connectivity solutions will set the standard for point-to-point wireless communications in the future,” said Stephen Drinan, director of Wireless Connectivity at Molex. “Our MX60 series extends Molex’s best-in-class connectivity solutions while leveraging our longstanding expertise in mmWave antenna design, signal integrity and volume manufacturing to ignite a new era of connectivity innovations.”

Unique capabilities propel seamless wireless connectivity

The MX60 series is based on unique, wireless chip-to-chip technology and more than 350 filed patent applications Molex acquired in 2021 with the purchase of core technology and intellectual property from Keyssa Inc., a pioneer in high-speed contactless connectivity. The acquired technology operates at data rates from 1-to-5.4 Gbps on the 60 GHz band with no Wi‑Fi or Bluetooth interference.

The first models in the MX60 series replace traditional DisplayPort, Gigabit Ethernet and USB SuperSpeed connectors to reduce development time, cost and risk. An integrated retimer optimizes signal integrity at higher data rates. Additionally, a space-saving, contactless solution that provides USB2 and other low-speed interfaces is currently in development.

“Every piece of real estate counts when designing smartphones, AR/VR glasses, smartwatches and other consumer devices,” said Walter Rivera, senior manager, Wireless Connectivity Product Manager for the Micro Solutions Business Unit at Molex. “By combining USB2 and other low-speed interfaces in one contactless solution, we will offer product developers a critical head-start as they won’t have to worry about fitting extra components into ever-shrinking form factors.”

Ideal for high-vibration applications and harsh environments

The MX60 series also improves the durability of products exposed to harsh environmental conditions, such as dust, moisture and corrosion. The solutions address a wide variety of applications and devices, including smartphones, AR/VR glasses, tablets, self-driving vehicles, video walls, industrial robotics, medical wearables, wireless docking stations and more.

These sealed, contact-free solutions provide significant benefits over physical metal-to-metal contacts, which can degrade over time and impact product performance and reliability. In contrast, Molex’s contactless connectivity solutions are less prone to risks associated with ingress and repeated motion, including high-vibration and rotational products. The ability to remove diagnostic ports on wirelessly charged devices also can reduce development and production costs while boosting overall product reliability.


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