Synopsys, Inc. (Nasdaq: SNPS) and FABU Technology Co., Ltd. today announced that FABU has selected a portfolio of silicon-proven Synopsys DesignWare® Interface, Security, ARC® EM Safety Island Processor, and Embedded Memory Test and Repair IP to deliver high-performance artificial intelligence (AI) system-on-chips (SoCs) for advanced automotive applications. FABU develops intelligent chips for object and lane detection, traffic light detection, vehicle localization, motion analysis, and environmental recognition that are used in advanced driver assistance systems (ADAS) and autonomous vehicles. FABU selected a broad portfolio of DesignWare IP to address their AI requirements for specialized processing, memory performance, real-time data connectivity, and stringent security. The Synopsys DesignWare IP for automotive applications is ISO 26262 ASIL B or ASIL D Ready certified, meets stringent AEC-Q100 temperature requirements, supports automotive quality management, and includes comprehensive automotive safety packages, enabling FABU to accelerate SoC-level functional safety assessments.
“With proprietary deep learning algorithms and a custom acceleration architecture, FABU is revolutionizing intelligent information processing with an enormous improvement in energy efficiency and performance,” said Hang Nguyen, chief technology officer at FABU America, a Research and Development Division of FABU. “Our ADAS and autonomous vehicle chip uses Synopsys’ portfolio of AI and automotive-ready DesignWare IP to help us integrate intelligent functionality into our SoC and accelerate the path to achieving system-level ISO 26262 compliance.”
“The new era of AI SoCs being used in applications such as automotive and cloud computing requires a wide range of IP to address diverse processing, memory, connectivity, and security needs,” said John Koeter, vice president of marketing for IP at Synopsys. “Synopsys is working with leading providers of AI SoCs, such as FABU, across all market segments to lower integration risk and accelerate time-to-market for the next generation of intelligent systems.”
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