September 22, 2023
September 21, 2023
Focusing on safety could finally take AVs beyond the hype
September 15, 2023
What’s shaping commercial transport concerns and priorities?
September 14, 2023
New solutions are needed to unlock the US hydrogen ecosystem
August 31, 2023
Is generative AI the key for cleaner commercial fleets?
August 30, 2023
Commercial fleet electrification gains momentum
August 29, 2023
Daimler’s Fuso backs battery swap for heavy trucks
August 17, 2023
AI can help eliminate CV driver distraction, says Nauto
August 15, 2023
Traton pins long-term success to sustainability
August 10, 2023
Can EVs and new safety tech transform trucking?
July 31, 2023
Hydrogen economy: progress report
July 27, 2023
What’s the final destination for urban mobility?
July 18, 2023
New vehicle makers find the going getting tougher
July 17, 2023
Inside Volvo Truck’s ZEV technology strategy
Webinars
30th November
4pm Stuttgart | 8:30pm Mumbai | 10am Detroit
Pioneering the integration of mixed-criticality applications in next-generation SDV architectures
Elektrobit’s Dr Bruno Kleinert and Francesco Petruzziello of ST reveal how the new Stellar Integration MCU’s virtualization enables isolated execution of multiple OS and AUTOSAR stack instances on a single chip.
1st December
2pm Stuttgart | 6:30pm Mumbai | 8am Detroit
Automotive aftersales in the digital age – a transformative journey ahead
KPIT’s Amit Shah and Julian Soanes explain how OEMs can successfully approach automotive aftersales in the digital age.
4th December
10am Stuttgart | 2:30pm Mumbai | 4am Detroit
Reducing SDV development time with a cloud-based framework solution
Continental’s Andreas Greff explains how to use the Continental Automotive Edge cloud-based framework for projects which require the decoupling of software and hardware development.
5th December
10am Stuttgart | 2:30pm Mumbai | 4am Detroit
Disentangling automotive ECU development with CPFlex
Jakob Kristoferitsch presents ETAS’ implementation of CPFlex and explains how it can help keep projects moving.